Boyee-UV Ink Production Line Solution

1. Sealed feeding and unpacking for contamination-free material handling. 2. Negative-pressure dust collection with fully enclosed conveying design. 3. No material contact with the ground or external environment throughout the process.

1. Centrifugal spray granulation forms highly spherical powders in a single step, minimizing hard agglomerates. 2.Specialized low-damage bead milling technology precisely deagglomerates particles while maintaining a narrow particle size distribution and eliminating oversized particles. 3.Delivers uniform particle size and excellent dispersibility, meeting the stringent requirements of ultra-thin dielectric layer manufacturing and large-scale production.

Equipped with an intelligent zero-gravity dosing system for accurate metering of powders, solvents, dispersants, and binders.Integrated with high-efficiency mixing equipment to ensure thorough solid‒liquid blending and uniform slurry composition.Minimizes batch-to-batch variation and delivers highly consistent material performance throughout production.

Two-Stage Sintering Process: Innovative dual-process technology combining primary sintering in a kiln with dynamic fine sintering in a rotary kiln. Dielectric Stability: Fully developed crystal structure and homogeneous grain distribution ensure excellent dielectric properties, temperature stability, and long-term reliability. Precise Temperature Control: Multi-zone temperature control accurately follows the required thermal profile, enabling effective debinding, grain growth, and complete phase transformation. Dynamic Fine Firing: Rotary kiln sintering with precise temperature and atmosphere control eliminates internal stress and promotes a dense, uniform microstructure.